Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2007-02-01
2009-10-20
Lewis, Monica (Department: 2894)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S774000
Reexamination Certificate
active
07605458
ABSTRACT:
Method and apparatus for integrating capacitors in stacked integrated circuits are described. One aspect of the invention relates to a semiconductor assembly having a carrier substrate, a plurality of integrated circuit dice, and at least one metal-insulator-metal (MIM) capacitor. The integrated circuit dice are vertically stacked on the carrier substrate. Each MIM capacitor is disposed between a first integrated circuit die and a second integrated circuit die of the plurality of integrated circuit dice. The at least one MIM capacitor is fabricated on at least one of a face of the first integrated circuit die and a backside of the second integrated circuit die.
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Rahman Arifur
Trimberger Stephen M.
Brush Robert M.
Lewis Monica
Maunu LeRoy D.
XILINX Inc.
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