Package making – Methods – Filling preformed receptacle and closing
Reexamination Certificate
2006-08-29
2006-08-29
Huynh, Louis (Department: 3721)
Package making
Methods
Filling preformed receptacle and closing
C053S473000, C414S810000, C029S762000
Reexamination Certificate
active
07096649
ABSTRACT:
While the manufacturing of integrated circuits (IC) has become a mostly automated process, the loading of the ICs into storage and shipping tubes105still requires a large amount of human interaction. A major stumbling block to the automation is the removal and insertion of retention pins115in the tubes. The present invention uses pressurized air406to hold a partially extracted retention pin115in position while the tube105is loaded. Once loaded, the retention pin115is reinserted. By not fully extracting the retention pin115, alignment is maintained, simplifying the reinsertion step.
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Carlin Omar
Estrada Jose Luis
Brady III Wade James
Huynh Louis
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
Tung Yingsheng
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