Metal fusion bonding – Process – Repairing – restoring – or renewing product for reuse
Patent
1998-06-24
2000-05-09
Ryan, Patrick
Metal fusion bonding
Process
Repairing, restoring, or renewing product for reuse
228 46, 2282341, 228264, B23K 3100, B23K 100, B23K 1018
Patent
active
060591706
ABSTRACT:
Method and apparatus removing a component having a solder ball grid array to a circuitized substrate. The solder balls have a first temperature at which they melt. The component has a second temperature, greater than the first temperature, over which the component is damaged. The method has a step of placing a thermal shield over the component. In a next step, the circuitized substrate and the component having the solder ball grid array are heated to a third temperature lower than the first temperature. In a next step, a stream of hot gas of a fourth temperature is directed for a predetermined time about the periphery of the thermal shield such that the solder balls reach the first temperature thereby reflowing the solder joints or balls, while other parts of the component reach less than the second temperature. At this point, the component is either attached to the circuitized substrate or permitted to be removed therefrom. Similar methods are also provided for attaching a component having a solder ball grid array from a circuitized substrate.
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Heim Craig G.
Jimarez Lisa J.
International Business Machines - Corporation
Ryan Patrick
Stoner Kiley
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