Method and apparatus for inspection of specular, three-dimension

Details Method and apparatus for inspection of specular, three-dimension Method and apparatus for inspection of specular, three-dimension

1989-12-21

1991-10-15

Boudreau, Leo H.

Image analysis

Histogram processing

For setting a threshold

358106, 356237, G06K 900, G06K 903

Patent

active

050581783

ABSTRACT:
Defective or missing solder bumps (18) on a surface (13) of an article (10) such as a chip carrier are detected by first illuminating the surface with dark field illumination. Next, the image of the surface of the article is captured, typically by a television camera (30). The captured image is processed to detect defects by first creating a window (57) in the image about each group of solder bumps and then creating a bounding box (58) about each bump in each window. Each of a set of attributes, including: the number, size and location of the windows, the size location and number of boxes in each window, and the dimensions, shape and brightness of the image in each box, is measured. The value of each attribute is compared to a reference value, representing the value of the attribute when no defects are present. If the attribute differs by more than a predetermined tolerance for its reference value, than a particular defect is prevent. Verification of certain defects may be accomplished by repeating the above-described process using bright field illumination.

REFERENCES:
patent: 4441025 (1984-04-01), Berkin et al.
patent: 4677473 (1987-06-01), Okamito et al.
patent: 4688939 (1987-08-01), Ray
patent: 4692943 (1987-09-01), Pietzsch et al.
patent: 4696047 (1987-09-01), Christian et al.

Affiliated with

Also associated with

Rating

Method and apparatus for inspection of specular, three-dimension does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for inspection of specular, three-dimension, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for inspection of specular, three-dimension will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-997483