Method and apparatus for inspection of pin grid array packages f

Optics: measuring and testing – Inspection of flaws or impurities

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Details

356399, 29741, G01N 2100

Patent

active

061280747

ABSTRACT:
A pin grid array inspection device includes an inspection gauge having a rectangular matrix of holes corresponding to leads of a pin grid array. In the preferred embodiment, a retractable device holder extends through a central opening in the inspection gauge. The device holder contacts the central leadless section of the pin grid array and provides a resting place for the pin grid array before an alignment mechanism grasps the pin grid array. An alignment mechanism positioned above the inspection gauge guides the pin grid array and aligns it to the inspection gauge. The device holder retracts, and the pin grid array descends into the inspection gauge due to gravity. An optical scanning receiver is mounted opposite of an optical scanning transmitter to receive an optical inspection beam. The optical scanning transmitter shines an optical inspection beam over the pin grid array as it rests in the inspection gauge. A bent lead will cause friction with its corresponding hole in the inspection gauge causing the pin grid array to remain at least partially raised above the inspection gauge. If the pin grid array does not lie flatly in the inspection gauge, and is therefore at least partially raised above the inspection, it blocks optical inspection beam, and an output circuit signals the automated operator that the pin grid array has at least one bent lead. If the pin grid array lies flatly in the inspection gauge, the pin grid array does not have any bent leads. The device holder also extends after the test to insure that the pin grid array is vertically elevated above the inspection gauge regardless of the test results.

REFERENCES:
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patent: 4691747 (1987-09-01), Sokolovsky
patent: 4728195 (1988-03-01), Silver
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patent: 5509192 (1996-04-01), Ota et al.
patent: 5591036 (1997-01-01), Doi et al.
"Component Placement Verification through Height Discontinuities," IBM Technical Disclosure Bulletin, vol. 29, No. 5, Oct. 1986, New York, pp. 2216-2223.

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