Optics: measuring and testing – By alignment in lateral direction – With registration indicia
Reexamination Certificate
2007-06-04
2008-08-05
Chowdhury, Tarifur R. (Department: 2886)
Optics: measuring and testing
By alignment in lateral direction
With registration indicia
Reexamination Certificate
active
07408643
ABSTRACT:
A method for alignment of a chip in a substrate surface inspection is provided, in which a surface of a substrate including a chip formed therein is inspected by using a beam. The method is characterized in comprising: a step of placing the substrate so that the chip is positioned within a field of view subject to the inspection; a step of measuring a magnification for the detection when the chip is positioned within the field of view subject to the inspection; a step of calculating a size of position error of the chip based on the measured magnification for the detection; and a step of compensating for the position of the chip based on the calculated position error.
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B. Lischke et al.,Multi-Beam Concepts for Nanometer Devices,Japanese Journal of Applied Physics, vol. 28, No. 10, pp. 2058-2064, 1989.
Kimba Toshifumi
Nakasuji Mamoru
Satake Tohru
Akanbi Isiaka O
Chowdhury Tarifur R.
Ebara Corporation
Westerman, Hattori, Daniels & Adrian , LLP.
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