Optics: measuring and testing – Inspection of flaws or impurities – Surface condition
Reexamination Certificate
2007-07-24
2007-07-24
Toatley, Jr., Gregory J. (Department: 2886)
Optics: measuring and testing
Inspection of flaws or impurities
Surface condition
Reexamination Certificate
active
10855808
ABSTRACT:
A method for alignment of a chip in a substrate surface inspection is provided, in which a surface of a substrate including a chip formed therein is inspected by using a beam. The method is characterized in comprising: a step of placing the substrate so that the chip is positioned within a field of view subject to the inspection; a step of measuring a magnification for the detection when the chip is positioned within the field of view subject to the inspection; a step of calculating a size of position error of the chip based on the measured magnification for the detection; and a step of compensating for the position of the chip based on the calculated position error.
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Translation of Written Opinion of the International Searching Authority Form PCT/ISA/237 of International Application No. PCT/JP2004/007351 filed May 28, 2004.
Kimba Toshifumi
Nakasuji Mamoru
Satake Tohru
Akanbi Isiaka O.
Ebara Corporation
Toatley , Jr. Gregory J.
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