Method and apparatus for inspecting component placement and sold

Details Method and apparatus for inspecting component placement and sold Method and apparatus for inspecting component placement and sold

1996-12-24

1998-06-02

Pham, Hoa Q.

Optics: measuring and testing

Inspection of flaws or impurities

Having predetermined light transmission regions

356394, 356376, G01B 1100

Patent

active

057608938

ABSTRACT:
A manufacturing defect analyzer, for inspecting assembled printed circuit boards, including a light source, an optical receiver, a computer controller, and a memory. A plurality of key-points are specified for each component mounted to a printed circuit board. A data record characterizing each key-point is then stored in memory. Next, the defect analyzer measures the height of selected key-points relative to reference key-points for each component. Finally, the measured heights are compared with limit values, thereby determining whether each component is defectively attached to the printed circuit board. The data records facilitate inspection of printed circuit boards having components that are available in different package types.

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patent: 5568264 (1996-10-01), Nakatsuka et al.

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