Method and apparatus for inspecting bent portions in wire loops

Details Method and apparatus for inspecting bent portions in wire loops Method and apparatus for inspecting bent portions in wire loops

1995-03-16

1996-01-16

Zanelli, Michael

Boots, shoes, and leggings

364560, 348126, 382146, G01B 1124

Patent

active

054853982

ABSTRACT:
In inspecting a bend of a wire which is bonded to, for example, a semiconductor device, a straight scale line with scale markings of constant intervals and a bonded-point line, both lines crossing each other at right angles, are shown on a monitor. An image of a wire that has a bend is monitored by a camera and displayed on a monitor. By overlapping the image of the bend of the wire on the scale line and then reading a scale marking which is closest to the bend of the wire, it is possible to ascertain the amount of the bend of the wire.

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