Method and apparatus for inserting leads into holes in substrate

Details Method and apparatus for inserting leads into holes in substrate Method and apparatus for inserting leads into holes in substrate

1984-05-21

1986-09-09

Rosenbaum, Mark

Metal working

Method of mechanical manufacture

Electrical device making

29741, 414730, 901 6, 901 45, 901 46, H05K 330, B23P 1900

Patent

active

046100849

ABSTRACT:
Apparatus and methods for inserting leads of an electric circuit component into correspondingly arranged holes in a printed wiring board by (a) holding the component by a robotic arm adjacent the board so that its leads contact the board under pressure and are in nominal registration in the X and Y directions, and (b) subjecting the board to the combined effect of two vibrating motions which are respectively directed in these two directions, and of which one is superimposed on the other. These two motions are each controlled in frequency and amplitude and differ from each other in a motion characteristic whereby the leads sweep in two-dimensional patterns over board areas respective to their corresponding holes and centrally including them until the leads substantially exactly register with the holes to become inserted therein by the pressure on the leads.

REFERENCES:
patent: 3241222 (1966-03-01), Timmermans
patent: 3736651 (1973-06-01), Law et al.
patent: 3779291 (1973-12-01), Yeo
patent: 3812569 (1974-05-01), Kufner et al.
patent: 4051593 (1977-10-01), Mori et al.
patent: 4089105 (1978-05-01), Yeo et al.
patent: 4204319 (1980-05-01), Bishop
patent: 4329776 (1982-05-01), Mori et al.
patent: 4472668 (1984-09-01), Mutschler et al.
Western Electric Tech Dig. No. 60, Oct. 1980, p. 9, by Edwards.

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