Method and apparatus for indirect planarization

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

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Reexamination Certificate

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07746089

ABSTRACT:
Methods and apparatus for indirect planarization of a substrate are provided herein. In one embodiment, an apparatus for indirectly planarizing a probe card assembly includes an adjustment portion for controlling a force applied to a probe substrate of the probe card assembly; a force application portion configured to apply the force to the probe substrate at a location that is laterally offset from the adjustment portion; and a mechanism coupling the adjustment portion to the force application portion.

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patent: 2003/0102878 (2003-06-01), Montoya
patent: 2005/0194983 (2005-09-01), Schwindt et al.
International Search Report and Written Opinion mailed Sep. 22, 2008 for PCT Application No. PCT/US07/79612.

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