Measuring and testing – Vibration – By mechanical waves
Patent
1991-08-29
1994-01-25
Williams, Hezron E.
Measuring and testing
Vibration
By mechanical waves
73644, G01N 2910, G01N 2928
Patent
active
052807223
ABSTRACT:
A method and apparatus are provided for indicating disbonds in joint regions. A critical bondline region is located between a first material and a second material having a higher acoustic impedance than the first material. A form member having an acoustic impedance which is substantially similar to the first material has a first face which is form fitted to a surface of the first material opposite to and non-parallel with the critical bondline region. The form member has an opposite second face which is shaped to be parallel to the critcal bondline region. Transducers are acoustically coupled to the second face of the form member to generate an ultrasonic tone burst through the acoustically similar form member and first material which is reflected by the critical bondline region. This reflected tone burst is received and a resulting signal is compared with a normal signal for no disbond to determine the presence of an unacceptable disbond.
REFERENCES:
patent: 4348904 (1982-09-01), Bautista, Jr.
patent: 4807476 (1989-02-01), Cook et al.
patent: 4848159 (1989-07-01), Kennedy et al.
patent: 4866986 (1989-09-01), Ciehanski
patent: 4901729 (1990-02-01), Saitoh et al.
Finley Rose M.
Williams Hezron E.
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