Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2006-03-27
2010-11-16
Pham, Hoai V (Department: 2892)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C438S125000, C257SE23101
Reexamination Certificate
active
07833838
ABSTRACT:
A method and apparatus for increasing the immunity of new generation microprocessors from electrostatic discharge events involve shielding the microprocessors at the die level. A gasket of a lossy material is provided on the substrate upon which the microprocessor is mounted. The gasket surrounds the microprocessor to protect it from electrostatic discharge pulses. A heat spreader is arranged in heat conducting relation with the microprocessor and atop at least a portion of the gasket adjacent the die. The material is a static dissipative material having a volume resistivity of greater than 102ohm cm and a shielding effectiveness to protect the microprocessor from at least 4 kV of electrostatic discharge pulse at the computer system level in which the microprocessor is to be used.
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Pham Hoai V
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