Method and apparatus for increasing temperature uniformity of he

Electric heating – Heating devices – Combined with container – enclosure – or support for material...

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219405, 392418, 118725, H01L 2120

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active

06084213&

ABSTRACT:
A method and apparatus are described for increasing the temperature uniformity of a wafer heated in a rapid thermal process (RTP) while the wafer is supported by a high emissivity structure in spaced relation above the head during the heating of the wafer; characterized in that a high-reflectivity ring, highly reflective to the radiation of the wafer, is provided on the head underlying the high emissivity ring.

REFERENCES:
patent: 4560420 (1985-12-01), Lord
patent: 4755654 (1988-07-01), Crowley et al.
patent: 4958061 (1990-09-01), Wakabayashi et al.
patent: 5781693 (1998-07-01), Ballance et al.

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