Measuring and testing – Inspecting
Patent
1998-01-08
1999-11-02
Raevis, Robert
Measuring and testing
Inspecting
H01L 2166
Patent
active
059749032
ABSTRACT:
An inspection station that is used to inspect an integrated circuit which is contained within a carrier tape and covered with a cover tape. The inspection station may include a spindle that receives an input reel which contains a carrier tape and a plurality of integrated circuits. The carrier tape can be attached to an output reel that is rotated by a drive motor. Another drive motor moves the carrier tape beneath a microscope that is located between the input reel and the output reel. The microscope may be coupled to a camera and a monitor which displays the integrated circuit. The inspection station may also include a de-taper mechanism which removes the cover tape before the integrated circuit is moved beneath the microscope, and a taper mechanism that reapplies cover tape back onto the integrated circuit. Removing the cover tape provides an unobstructed view of the integrated circuit. Removing the cover tape also allows the operator to replace defective integrated circuits on the carrier tape.
REFERENCES:
patent: 4389669 (1983-06-01), Epstein et al.
patent: 5473425 (1995-12-01), Tokumaru et al.
Bowser Chad D.
Shirley R. Scott
Intel Corporation
Raevis Robert
LandOfFree
Method and apparatus for in situ visual inspection of die produc does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for in situ visual inspection of die produc, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for in situ visual inspection of die produc will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2121266