Semiconductor device manufacturing: process – With measuring or testing
Patent
1997-07-03
1999-07-27
Picardat, Kevin M.
Semiconductor device manufacturing: process
With measuring or testing
438 15, 438 16, 324537, 324765, G01R 3126, H01L 2166
Patent
active
059305860
ABSTRACT:
A method and apparatus for detecting copper (Cu) contamination on the backside of a wafer (120) begins by providing the wafer (120). The wafer (120) is rotated about a rotational axis via a motor/computer controlled wafer stage (118). In addition to rotation of the wafer (120), motor/computer control of a monochromator (116) is used to raster scan an X-ray beam (114b) across a surface of the rotating wafer (120). A plurality of X-ray detectors (122) are arrayed in one or more rows in close proximity to the scanned surface of the semiconductor wafer (120). The detectors (122), detect X-ray fluorescence emission from the surface of the wafer (120) whereby copper contamination of the wafer (120) can be determined in an accurate and time efficient manner which enables contamination detection in-line with normal wafer processing.
REFERENCES:
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patent: 5233191 (1993-08-01), Noguchi et al.
patent: 5463459 (1995-10-01), Morioka et al.
patent: 5483568 (1996-01-01), Yano et al.
patent: 5575885 (1996-11-01), Hirabayashi et al.
Hance Robert L.
Jain Ajay
Collins D. Mark
Motorola Inc.
Picardat Kevin M.
Witek Keith E.
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