Method and apparatus for improving thermal coupling between a co

Details Method and apparatus for improving thermal coupling between a co Method and apparatus for improving thermal coupling between a co

1989-08-07

1991-03-19

Mintel, William

Electrical connectors

With circuit conductors and safety grounding provision

Grounding to connector container or housing

357 81, 357 72, 357 68, 439571, 439431, 439432, H01L 2302

Patent

active

050015478

ABSTRACT:
A semiconductor component package comprises a metal plate and a synthetic resin housing or body. The plate is formed with an aperture by which it can be secured to a heat sink, generally a metal plate. Around the aperture is a weakened annular portion produced by shearing. When the package housing is secured to a surface which is not completely flat, mechanical stressing due to the tightening of the screw coupling is limited to the weakened annular portion and is not transmitted to the resin housing and to the elements therein.

REFERENCES:
patent: 1016728 (1912-02-01), Barber
patent: 3522490 (1970-08-01), Kauffman
patent: 3942857 (1976-03-01), Hennemann
patent: 4249034 (1981-02-01), Fichot et al.
patent: 4451973 (1984-06-01), Tateno et al.
patent: 4510677 (1985-04-01), Collumeau

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