Method and apparatus for improving the performance of edge...

Details Method and apparatus for improving the performance of edge... Method and apparatus for improving the performance of edge...

2005-03-08

2005-03-08

Duverne, J. F. (Department: 2839)

Electrical connectors

With circuit conductors and safety grounding provision

Direct grounding of coupling part member passing into aperture

Reexamination Certificate

active

06863548

ABSTRACT:
A method and apparatus for improving the performance of an edge launch electrical connector. Two or more edge vias are established along an edge face of a planar circuit module, such as a single- or multi-layer PCB, integrated circuit on a ceramic or organic substrate or a ceramic or organic package, thereby providing a short path from one or more of the substrate assembly's ground planes to a ground associated with the edge launch electrical connector, reducing jitter and providing a solution with low insertion and return losses. The two edge vias may be standard vias, castellations or wires or lines deposited, printed, painted, secured or put in contact with an edge face of the planar circuit module and are arranged at each side of the signal line thereby providing additional electromagnetic shielding. Optionally, an air line may be established to increase the operational cut-off frequency and/or improve electrical performance.

REFERENCES:
patent: 3871728 (1975-03-01), Goodman
patent: 4697858 (1987-10-01), Balakrishnan
patent: 5154625 (1992-10-01), Borokowski et al.
patent: 5853303 (1998-12-01), Brunker et al.
patent: 6468089 (2002-10-01), Hubbard et al.
patent: 6762942 (2004-07-01), Smith
Wideband End Launch Assemblies Mount on Edge of Circuit Boards; Southwest Microwave, Inc., www.southwestmicrowave.com.
Backside Connections; Bill Oldfield; Wiltron Co, Morgan Hill, CA Microwave Journal, 10/01.

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