Method and apparatus for improving force control in wafer...

Details Method and apparatus for improving force control in wafer... Method and apparatus for improving force control in wafer...

2007-02-21

2010-10-05

Maldonado, Julio J (Department: 2823)

Semiconductor device manufacturing: process

Including control responsive to sensed condition

Optical characteristic sensed

C438S008000, C438S009000, C438S462000, C257SE21521, C257SE21529

Reexamination Certificate

active

07807479

ABSTRACT:
When scribing a substrate, the precise location of the outer peripheral edge of the substrate on a stage is determined and movement of a scribe tool is controlled to first bring the scribe tool into engagement with the substrate at a location inwardly of the outer peripheral edge of the substrate. After a downwardly directed force of predetermined magnitude exerted by the scribe tool has been attained and stabilized, the scribe tool is moved along the substrate to form a scribe line.

REFERENCES:
patent: 3094785 (1963-06-01), Kulicke, Jr.
patent: 4966520 (1990-10-01), Yokota et al.
patent: 5820006 (1998-10-01), Turner
patent: 2004/0135232 (2004-07-01), Bakel et al.

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