Method and apparatus for improving defective solder joint...

Details Method and apparatus for improving defective solder joint... Method and apparatus for improving defective solder joint...

2005-06-28

2005-06-28

Flynn, Nathan I. (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Ball or nail head type contact, lead, or bond

Reexamination Certificate

active

06911738

ABSTRACT:
An assembly and method for detecting defective and open solder joints of an area array packages attached to a printed circuit assembly is presented. The assembly employs offset pad layout on either or both of the printed circuit assembly or the area array package allowing improved solder joint defect detection.

REFERENCES:
patent: 5886409 (1999-03-01), Ishino et al.
patent: 2004/0026107 (2004-02-01), Caldwell et al.

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