Method and apparatus for improved semiconductor wafer polishing

Details Method and apparatus for improved semiconductor wafer polishing Method and apparatus for improved semiconductor wafer polishing

1998-11-05

2000-08-15

Eley, Timothy V.

Abrading

Abrading process

Glass or stone abrading

451 44, 451 59, 451 63, D24B 100

Patent

active

061027790

ABSTRACT:
In semiconductor wafer polishing, a backing pad is sized smaller than the wafer being polished so as to produce a desired backset, allowing the wafer to bend, thereby reducing over-polish at the wafer edge.

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patent: 5636964 (1997-06-01), Somekh et al.
patent: 5647626 (1997-07-01), Chen et al.
patent: 5681215 (1997-10-01), Sherwood et al.
patent: 5913719 (1999-06-01), Hasegawa et al.

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