Method and apparatus for improved semiconductor wafer polishing

Details Method and apparatus for improved semiconductor wafer polishing Method and apparatus for improved semiconductor wafer polishing

1998-06-17

1999-11-30

Eley, Timothy V.

Abrading

Abrading process

Glass or stone abrading

451 44, 451 59, 451 63, B24B 100

Patent

active

059932937

ABSTRACT:
In semiconductor wafer polishing, a backing pad is sized smaller than the wafer being polished so as to produce a desired backset, allowing the wafer to bend, thereby reducing over-polish at the wafer edge.

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