Method and apparatus for improved conditioning of polishing pads

Details Method and apparatus for improved conditioning of polishing pads Method and apparatus for improved conditioning of polishing pads

1999-05-17

2000-09-26

Scherbel, David A.

Abrading

Abrading process

With tool treating or forming

451 43, 451444, 451 72, B24B 100

Patent

active

061236071

ABSTRACT:
A method and apparatus for conditioning the surface of a polishing pad used to polish a substrate, such as a semiconductor wafer. A conditioning apparatus uses two or more end effectors to abrade and/or remove the polishing byproducts from the surface of the pad. Different types of conditioning performance can be achieved when the end effectors are employed individually, sequentially, or simultaneously during a polishing process.

REFERENCES:
patent: 5154021 (1992-10-01), Bombardier et al.
patent: 5486131 (1996-01-01), Cesna et al.
patent: 5547417 (1996-08-01), Breivogel et al.
patent: 5611943 (1997-03-01), Cadien et al.
patent: 5833519 (1998-11-01), Moore

Affiliated with

Also associated with

Rating

Method and apparatus for improved conditioning of polishing pads does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for improved conditioning of polishing pads, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for improved conditioning of polishing pads will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2095461