Method and apparatus for improved conditioning of polishing pads

Details Method and apparatus for improved conditioning of polishing pads Method and apparatus for improved conditioning of polishing pads

1998-01-07

1999-08-24

Scherbel, David A.

Abrading

Abrading process

With tool treating or forming

451 72, 451443, B24B 100

Patent

active

059417625

ABSTRACT:
A method and apparatus for conditioning the surface of a polishing pad used to polish a substrate, such as a semiconductor wafer. A conditioning apparatus uses two or more end effectors to abrade and/or remove the polishing byproducts from the surface of the pad. Different types of conditioning performance can be achieved when the end effectors are employed individually, sequentially or simultaneously during a polishing process.

REFERENCES:
patent: 5154021 (1992-10-01), Bombardier et al.
patent: 5486131 (1996-01-01), Cesna et al.
patent: 5547417 (1996-08-01), Breivogel et al.
patent: 5611943 (1997-03-01), Cadien et al.
patent: 5779521 (1998-07-01), Muroyama et al.
patent: 5782675 (1998-07-01), Southwick
patent: 5857899 (1999-01-01), Volodarsky

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