Coating processes – Centrifugal force utilized
Patent
1997-10-17
1999-09-14
Bell, Janyce
Coating processes
Centrifugal force utilized
118 52, 118500, 4273855, 427377, 437231, B05D 312, B05C 1102, H01L 21469
Patent
active
059520450
ABSTRACT:
Disclosed is a spin coating apparatus and method for coating a semiconductor wafer of known diameter with a thin and substantially uniform coating of a solution. The apparatus comprises a containment bowl with a rotatable vacuum chuck, having a diameter less than hat of the wafer, rotatably mounted inside the bowl. The vacuum chuck captively holds a bottom surface of the wafer. Directly beneath the bottom surface of the wafer is a substantially frustroconical deflector ring. The deflector ring is concentrically attached about and stationary with respect to the rotatable vacuum chuck. The top surface of the ring is located just below and in close-spaced parallel relation to the bottom surface of the wafer. The top face of the deflector has a minimum diameter that is greater that the diameter of the semiconductor wafer. With the system of this invention the requirement of an organic solvent wash of the wafer backside after the coating of the wafer top surface is eliminated.
REFERENCES:
patent: 4838979 (1989-06-01), Nishida
patent: 5658615 (1997-08-01), Hasebe et al.
Bell Janyce
Micro)n Technology, Inc.
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