Coating apparatus – With means to centrifuge work
Patent
1997-10-10
1999-05-11
Beck, Shrive
Coating apparatus
With means to centrifuge work
118321, 118323, 118715, 427240, B05C11/02
Patent
active
059023996
ABSTRACT:
A method and apparatus for coating liquid films on to the surface of a wafer substrate by rotation the substrate at a speed sufficient to cause a liquid, through centrifugal effect, to flow outwardly toward the perimeter of the surface and form a substantially uniform thickness liquid coating thereon and starting at the central region of the wafer surface and moving radially outward therefrom, spraying a fine mist of the liquid to the surface of the wafer.
REFERENCES:
patent: 4190015 (1980-02-01), Hillman
patent: 4267212 (1981-05-01), Sakawaki
patent: 4457259 (1984-07-01), Samuels
patent: 4640222 (1987-02-01), Gerber
patent: 5250114 (1993-10-01), Konishi et al.
patent: 5405443 (1995-04-01), Akimoto et al.
Barr Michael
Beck Shrive
Micro)n Technology, Inc.
LandOfFree
Method and apparatus for improved coating of a semiconductor waf does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for improved coating of a semiconductor waf, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for improved coating of a semiconductor waf will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-243601