Method and apparatus for improved chemical mechanical...

Details Method and apparatus for improved chemical mechanical... Method and apparatus for improved chemical mechanical...

2007-04-06

2010-12-07

Rose, Robert (Department: 3727)

Abrading

Precision device or process - or with condition responsive...

By optical sensor

C451S527000, C451S529000

Reexamination Certificate

active

07846008

ABSTRACT:
A polishing pad includes a guide plate, a porous slurry distribution layer and a flexible under-layer. Polishing elements are interdigitated with one another through the slurry distribution layer and the guide plate. The polishing elements may be affixed to the compressible under-layer and pass through corresponding holes in the guide plate so as to be maintained in a substantially vertical orientation with respect to the compressible under-layer but be translatable in a vertical direction with respect to the guide plate. Optionally, a membrane may be positioned between the guide plate and the slurry distribution layer. The polishing pad may also include wear sensors to assist in determinations of pad wear and end-of-life.

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