Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – With vibration step
Reexamination Certificate
2007-10-23
2007-10-23
Malsawma, Lex (Department: 2823)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
With vibration step
C438S637000, C257SE21577
Reexamination Certificate
active
10607294
ABSTRACT:
Embodiments of a method and apparatus for imprinting a trench pattern on a substrate using ultrasonic vibrations. The trench pattern corresponds to a circuit pattern that is to be formed on the substrate, the circuit pattern including a number of conductive traces and other conductive elements. In one embodiment, the substrate includes a base layer and a layer of dielectric material overlying a surface of the base layer, and the circuit pattern is formed in the dielectric layer.
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