Method and apparatus for implementing very high density...

Details Method and apparatus for implementing very high density... Method and apparatus for implementing very high density...

2005-05-17

2005-05-17

Tang, Minh N. (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S1540PB

Reexamination Certificate

active

06894516

ABSTRACT:
A method and apparatus are provided for implementing very high density signal probing of a printed circuit board having a pad pattern connected to signals of interest. A metal plate includes a plurality of through holes arranged in a predefined pattern that corresponds to the pad pattern on the printed circuit board. At least one signal module is inserted within a selected one of the through holes of the metal plate. Each signal module defines a coaxial connector for electrical mating engagement with a coaxial cable connector and has an embedded resistor. At least one power/ground module is inserted within a selected one of the through holes. Each power/ground module contains a high dielectric constant material between an outer conductor and a center conductor defining a capacitor. The capacitor provides a low impedance path between the metal plate and a power or ground pad of the printed circuit board.

REFERENCES:
patent: 4820169 (1989-04-01), Weber et al.
patent: 6592381 (2003-07-01), Cohen et al.

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