Data processing: generic control systems or specific application – Specific application – apparatus or process – Product assembly or manufacturing
Reexamination Certificate
2006-05-23
2006-05-23
Picard, Leo (Department: 2125)
Data processing: generic control systems or specific application
Specific application, apparatus or process
Product assembly or manufacturing
C700S121000, C716S030000
Reexamination Certificate
active
07050871
ABSTRACT:
Methods and apparatus are provided for implementing silicon wafer chip carrier passive devices including customized silicon capacitors and resistors mounted directly on a module or carrier package. A plurality of system design inputs is received for a package arrangement. A respective physical design is generated for customized passive devices, a logic chip, and a chip carrier. Silicon devices are fabricated utilizing the generated respective physical design for customized passive devices and the logic chip and a carrier package is fabricated. The fabricated silicon devices are assembled on the carrier package.
REFERENCES:
patent: 5307559 (1994-05-01), Long
patent: 6452250 (2002-09-01), Buynoski
patent: 6511873 (2003-01-01), Ballantine et al.
patent: 6524905 (2003-02-01), Yamamichi et al.
patent: 6541840 (2003-04-01), Terayama et al.
patent: 6898769 (2005-05-01), Nassif et al.
patent: 2004/0108587 (2004-06-01), Chudzik et al.
patent: 2005/0108671 (2005-05-01), Becker et al.
patent: 0417345 (1991-03-01), None
Bartley Gerald Keith
Becker Darryl John
Dahlen Paul Eric
Germann Philip Raymond
Maki Andrew B.
Garland Steven R.
International Business Machines - Corporation
Pennington Joan
Picard Leo
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