Method and apparatus for implementing engineering changes for in

Electricity: electrical systems and devices – Miscellaneous

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174254, 174260, 174261, 361396, 361395, 361398, 361404, 361405, 361406, 361408, 361409, 361417, 439 83, 257724, H05K 114, H01L 3906, H01R 909

Patent

active

051842840

ABSTRACT:
Engineering changes (EC) for an integrated-circuit (IC) module or circuits connected to an IC module sometimes require the addition of discrete electrical components or circuit chips. Such engineering changes are implemented herein on a small printed circuit card or board that may be physically attached to the top of the IC module. The EC pads on the printed circuit EC card are juxtaposed with the IC module input/output (I/O) pins that require the engineering change. A short fly wire is then soldered between each juxtaposed EC pad and the I/O pin to make the electrical connection between the EC card and the module. In this way, no additional surface area is consumed on the printed circuit board on which the module is mounted.

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IBM Disclosure Bulletin "Replacement Pads for SMT Components on Printed Circuit Boards" vol. 33 No. 3A Aug. 1990.

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