Method and apparatus for imager die package quality testing

Details Method and apparatus for imager die package quality testing Method and apparatus for imager die package quality testing

2006-10-17

2006-10-17

Epps, Georgia (Department: 2878)

Radiant energy

Photocells; circuits and apparatus

With circuit for evaluating a web, strand, strip, or sheet

C382S141000, C382S145000, C356S237100, C356S239200

Reexamination Certificate

active

07122819

ABSTRACT:
An apparatus and method of detecting a defect in an imager die package. The method comprises the steps of exposing the imager die package to light at a first angle, exposing the imager die package to light at a second angle, outputting electrical signals based on the exposures; and determining the level at which a defect is present based on the output electrical signals. An exemplary embodiment of the apparatus comprises a first light source positioned over an imager die package at a first angle, a second light source over the imager die package at a second angle, said first and second angles being different from each other; and a processor for determining a level of defection in the die package.

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