Method and apparatus for hybrid I.C. lithography

Details Method and apparatus for hybrid I.C. lithography Method and apparatus for hybrid I.C. lithography

1986-08-20

1989-03-14

Anderson, Bruce C.

Radiant energy

Means to align or position an object relative to a source or...

2504922, 250398, H01J 37304

Patent

active

048126616

ABSTRACT:
A method and apparatus for hybrid integrated circuit lithography wherein an E-beam lithographic exposure is accurately aligned with a preexisting optical lithographic exposure. In one embodiment, the method includes deflecting an E-beam to chip marks while holding the integrated circuit substantially stationary to determine a plurality of deflector parameters, and then moving the integrated circuit while holding the E-beam substantially stationary to determine a number of stage parameters. In a second embodiment, the chip marks are accessed by a combination of stage movements and deflector movements to determine a number of compound parameters. The stage and deflector parameters or, alternatively, the compound parameters, are used to convert the pattern data base of an E-beam machine into a transformed data base which accurately matches the E-beam exposure to the optical exposure.

REFERENCES:
patent: 4390788 (1983-06-01), Hayashi et al.
patent: 4443703 (1984-04-01), Shimazu et al.
patent: 4603473 (1986-08-01), Suemitsu et al.

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