Method and apparatus for holding laser wafers during a fabricati

Details Method and apparatus for holding laser wafers during a fabricati Method and apparatus for holding laser wafers during a fabricati

1998-12-23

2000-11-07

Eley, Timothy V.

Abrading

Abrading process

With critical temperature modification or control of work or...

451364, 451460, B24B 100

Patent

active

061428531

ABSTRACT:
A method and apparatus utilizing a thermal release mounting material to adhere a laser wafer to a wafer support during a semiconductor fabrication process is provided. A first surface of the mounting material contains an adhesive and is adhered to a wafer support. The wafer support contains apertures for allowing air bubbles to escape while the mounting material is being applied to the wafer support, thus, ensuring that the film is planar to the support. The laser wafer is adhered to a second surface of the mounting material. The second surface of the mounting material comprises a thermal release material. After undergoing the fabrication process, the thermal release material of the mounting material is heated to a release temperature allowing the laser wafer to be readily removed from the wafer support.

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patent: 5788560 (1998-08-01), Hashimoto et al.
patent: 5791975 (1998-08-01), Cesna et al.

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