Method and apparatus for holding, grinding and polishing a packa

Details Method and apparatus for holding, grinding and polishing a packa Method and apparatus for holding, grinding and polishing a packa

1998-06-23

2000-02-29

Hail, III, Joseph J.

Abrading

Work holder

B24B 4100

Patent

active

060302828

ABSTRACT:
A method and apparatus for holding, grinding and polishing a die include a platform (10), a boss (20) on the platform, and a shielding structure (30) attached to at least one of the platform (10) and the boss (20). The boss (20) is configured for supporting a packaged (42) die (41) to be ground and polished and has a supporting topography to accommodate at least one package and lead configuration. The shielding structure (30) is configured to protect such a packaged (42) die (41) from physical and electrical damage when supported on the boss (20).

REFERENCES:
patent: 3996659 (1976-12-01), Gaicki et al.
patent: 5340011 (1994-08-01), Sanchez
patent: 5786632 (1998-07-01), Farnworth et al.

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