Method and apparatus for holding a semiconductor wafer during a

Details Method and apparatus for holding a semiconductor wafer during a Method and apparatus for holding a semiconductor wafer during a

1995-03-09

1997-01-28

Kisliuk, Bruce M.

Abrading

Machine

Rotary tool

451 41, 451 36, 451289, B24B 700

Patent

active

055973469

ABSTRACT:
An improved semiconductor wafer carrier (16) holds semiconductor wafer (14) during a CMP process and achieves a more uniform layer of slurry (24) at greater polishing speeds. Carrier (16) directs slurry (24) between semiconductor wafer (14) and conditioning pad (22) and includes wafer holding surface (52) for holding semiconductor wafer (14) as semiconductor wafer (14) contacts conditioning pad (22) and slurry (24). Outer rim portion (56) surrounds semiconductor wafer holding surface (52). A plurality of slurry channels (58) associate with outer rim portion (56) for receiving slurry (24) and directing slurry (24) between semiconductor wafer (14) and conditioning pad (22) for maintaining a uniform layer of slurry (24) between semiconductor wafer (14) and conditioning pad (22).

REFERENCES:
patent: 2826009 (1958-03-01), Sharson
patent: 2883802 (1959-04-01), Katzke
patent: 3568371 (1971-03-01), Day et al.
patent: 3659384 (1972-05-01), Day
patent: 5078801 (1992-01-01), Mauk
patent: 5232875 (1993-08-01), Tuttle et al.

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