Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2007-09-11
2007-09-11
Zarneke, David A. (Department: 2891)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C257S713000, C257SE23082, C257SE23085, C257SE23145
Reexamination Certificate
active
10946813
ABSTRACT:
Embodiments of methods and apparatus for high temperature operation of electronics according to the invention are disclosed. One embodiment of the invention generally includes an integrated circuit package having a substrate. A plurality of integrated circuits are coupled to a surface of the substrate. A lid is positioned above the substrate facing the surface. One or more pieces of compliant and thermally conductive material are compressed between at least one of the integrated circuits and the lid. The lid defines in part an enclosed volume containing the compliant and thermally conductive material.
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Golla Christopher
Masino James
Schultz Roger L.
Baker & Botts L.L.P.
Halliburton Energy Service,s Inc.
Zarneke David A.
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