Method and apparatus for high-performance bonding resequencing

Multiplex communications – Pathfinding or routing – Switching a message which includes an address header

Reexamination Certificate

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C370S412000

Reexamination Certificate

active

07957392

ABSTRACT:
A method, system, and computer program product for receiving and resequencing a plurality of data segments received on a plurality of channels of a bonding channel set, comprising deter mining if a sequence number of a received segment matches an expected sequence number. If so, the process includes forwarding the segment for further processing, incrementing the expected sequence number; and forwarding any queued packets corresponding to the expected sequence number and immediately succeeding sequence numbers less than a sequence number of annexed missing segment. If the sequence number of the received segment does not match the expected sequence number, the received segment is queued at a memory location. The address of this location is converted to a segment index. The segment index is stored in a sparse array.

REFERENCES:
patent: 6047364 (2000-04-01), Kolagotla et al.
patent: 6934760 (2005-08-01), Westbrook et al.
patent: 7489641 (2009-02-01), Miller et al.
patent: 2003/0214949 (2003-11-01), Shaikli
patent: 2004/0143593 (2004-07-01), Le Maut et al.
patent: 2007/0097907 (2007-05-01), Cummings
patent: 2007/0206600 (2007-09-01), Klimker et al.
patent: 2008/0130649 (2008-06-01), Pullen
patent: WO 00/60813 (2000-10-01), None
patent: WO 2006/020559 (2006-02-01), None
Search Report and Written Opinion for International Application No. PCT/US2007/021395 mailed Apr. 9, 2008, 10 pgs.
Notification Concerning Transmittal of International Preliminary Report on Patentability, International Application No. PCT/US2007/021395, International Filing Date: Oct. 5, 2007.

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