Method and apparatus for hermetically sealing photonic devices

Optical waveguides – With disengagable mechanical connector – Optical fiber to a nonfiber optical device connector

Reexamination Certificate

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C385S088000, C385S092000

Reexamination Certificate

active

06932522

ABSTRACT:
A hermetically sealed photonic device submount includes a photonic device mounted on a substrate material and sealed in a flexible hermetic seal. In one configuration, the photonic device is configured to emit or to receive light through the substrate material. In this configuration, the photonic device is covered with an adhesive layer and a metal layer depositd onto the adhesive layer. In another configuration, the photonic device is configured to emit or to receive light in a direction substantially vertically upward from the substrate material. In this configuration, a cover is placed over the photonic device, then the cover is hermetically sealed to the substrate material with an adhesive layer and a metal layer depositd onto the adhesive layer. In both configurations, the photonic device submounts are hermetically sealed according to various aspects of the present invention on the substrate material without using a separate package. Accordingly, any number of hermetically sealed photonic device submounts can be mass produced on wafers using the present invention.

REFERENCES:
patent: 4092061 (1978-05-01), Stigliani, Jr.
patent: 4441805 (1984-04-01), Smith
patent: 4952016 (1990-08-01), Adams et al.
patent: 4962991 (1990-10-01), Carvalho
patent: 5125054 (1992-06-01), Ackley et al.
patent: 5249245 (1993-09-01), Lebby et al.
patent: 5253311 (1993-10-01), Killen et al.
patent: 5262364 (1993-11-01), Brow et al.
patent: 5359686 (1994-10-01), Galloway et al.
patent: 5361317 (1994-11-01), Hartman et al.
patent: 5371820 (1994-12-01), Welbourn et al.
patent: 5375184 (1994-12-01), Sullivan
patent: 5414786 (1995-05-01), Ohta et al.
patent: 5420954 (1995-05-01), Swirhun et al.
patent: 5499312 (1996-03-01), Hahn et al.
patent: 5539848 (1996-07-01), Galloway
patent: 5596662 (1997-01-01), Boscher
patent: 5613024 (1997-03-01), Shahid
patent: 5625734 (1997-04-01), Thomas et al.
patent: 5666449 (1997-09-01), Sawae et al.
patent: 5706378 (1998-01-01), Suzuki et al.
patent: 5717800 (1998-02-01), Funabashi
patent: 5774614 (1998-06-01), Gilliland et al.
patent: 5790731 (1998-08-01), Deveau
patent: 5814870 (1998-09-01), Spaeth
patent: 6081638 (2000-06-01), Zhou
patent: 6194789 (2001-02-01), Zhou
patent: 6205274 (2001-03-01), Zhou
patent: 6521989 (2003-02-01), Zhou
patent: 19527026 (1995-07-01), None
patent: 0335691 (1989-10-01), None
patent: 413 489 (1991-02-01), None
patent: 0619507 (1994-12-01), None
patent: 58153388 (1983-09-01), None
patent: 60086887 (1985-05-01), None
patent: 60088486 (1985-05-01), None
patent: 60180183 (1985-09-01), None
patent: 61206284 (1986-09-01), None
patent: 62269374 (1987-11-01), None
patent: 63066985 (1988-03-01), None
patent: 63084184 (1988-04-01), None
patent: 63280206 (1988-11-01), None
patent: 1140791 (1989-06-01), None
patent: 1227484 (1989-09-01), None
patent: 01256189 (1989-10-01), None
patent: 02090585 (1990-03-01), None
patent: 02106989 (1990-04-01), None
patent: 02126685 (1990-05-01), None
patent: 2222185 (1990-09-01), None
patent: 4324987 (1992-11-01), None
patent: 5021899 (1993-01-01), None
patent: 06209138 (1994-07-01), None
patent: 06216406 (1994-08-01), None
patent: 5279967 (1995-05-01), None
patent: 8241900 (1996-09-01), None
patent: 8101759 (1997-11-01), None
patent: 9041951 (1998-09-01), None
patent: 10242442 (1998-09-01), None
patent: WO 92/00538 (1992-01-01), None
Ali, “New Materials and Design Components for Integrated Optics”, Technology Report/Fiberoptics, Laser Focus World, vol. 21, No. 8 Aug. 1985, Tulsa, U.S., pp 4850.
Cohen, “Passive Laser-Fiber Alignment by Index Method”, IEEE Photonics Technology Letters, vol. 3, No. 11, Dec. 1991, pp 985987, New York, U.S.
Havant, “Flexible Interposing Carrier Scheme for Optical Waveguides”, Research Disclosure No. 303, Jul. 1989, p. 512.
Teska, “Fine Line PCB Assembly Leads to New Test Issues”, Electronic Packaging & Production, pp 54-56, 1998.
Plawsky, et al. “PhotochemicalyMachined, Glass Ceramic, Optical Fiber Interconnection Components”, article, Optoelectronic Materials, Devices, Paœging and Interconnects (1988), SPIE, vol. 994 pp 101-106.
Shweky, “A CSP Optoelectronic Package For Imaging And Light Detection Applications”, Part of the IS&T/SPIE Conference on Sensors, Cameras, and Applications, pp 688, 1999.
Sullivan, et al., “Polymeric Waveguides”, 1992 IEEE, pp 2731.
J. Faris, T. Kocian, “DMD™ Packages—Evolution and Strategy”, DLP-DMD Manufacturing and Design Challenges, Jul.-Sep. 1998, pp 87-94.
D.S. Alles, “Trends in Laser Packaging”, 1997 electronic Components and Technology Conference, pp 185-190.
Dr. M. Spector, “Design of a Solid State laser Hybrid Package”, GTE Lenkurt, Inc., Fiber Optics Communications Division, Moutain View, CA, pp 172-174.
H. Kosak, M. Kajita, M. Yamada, Y. Sugimoto, NEC Opt-Electronics Research Laboratories, Japan; K. Kurata, T. Tanabe, NEC2nd Transmission Division, Japan; Y. Kasukawa, NEC Electromechanical Devices Division; Plastic-Based Receptacle-Type VCSEL-Array Modules with One and Two Dimensions Fabricated Using the Sel-fAlignment Mounting Technique, 1997 Electronic Components and Technology Conference, -07 803-3857-X/97 ©1997 IEEE.
L.J. Norton, F. Carney, N. Choi, C.K.Y. Chun R.K. Denton Jr., D. Diaz, J. Knapp, M. Meyering, C. Ngo, S. Planer, G. Raskin, E. Reyes, J. Sauvageau, D.B. Schwartz, S.G. Shook J. Yoder Ad Y. Wen, Optobus™ I: A Production Parallel Fiber Optical Interconnect, 1997 Electronic Components ad Technology Conference, -07803-3857-Z/97 ©1997 IEEE.

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