Method and apparatus for heating semiconductor wafers

Heating – Processes of heating or heater operation – Controlling flame position or work atmosphere

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Details

34 36, 118 501, 118725, 219400, 432198, 432205, F27B 322, F27B 504, C23C 1400, C23C 1600

Patent

active

045977364

ABSTRACT:
A method and apparatus for heating semiconductor wafers characterized by the release of preheated nitrogen into an oven to considerably reduce heating time for the wafers. The oven is evacuated prior to the release of the preheated nitrogen.

REFERENCES:
patent: 1802000 (1931-04-01), Brooke
patent: 4223048 (1980-09-01), Engle, Jr.
patent: 4347431 (1982-08-01), Pearce et al.
patent: 4375027 (1983-02-01), Zeto et al.

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