Method and apparatus for heating semiconductor wafers

Details Method and apparatus for heating semiconductor wafers Method and apparatus for heating semiconductor wafers

1982-05-14

1984-05-15

Reynolds, B. A.

Electric heating

Heating devices

Combined with container, enclosure, or support for material...

219 1043, 219 1049R, 219 1069, 118725, 118 501, 427 451, 427 49, F27B 906, C23C 1308

Patent

active

044490372

ABSTRACT:
A system and method for evenly heating semiconductor wafers in a horizontal elongated reaction tube, wherein a furnace surrounding only a part of the length of the reaction tube is caused to move so as to pass along each wafer placed in the reaction tube. The system is especially useful for processing wafers at high temperatures for a short period of time.

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patent: 3893876 (1975-07-01), Akai et al.
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patent: 4129090 (1978-12-01), Inaniwa et al.
patent: 4147432 (1979-04-01), Yamawaki et al.
patent: 4275094 (1981-06-01), Takagi et al.

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