Method and apparatus for heat treating

Details Method and apparatus for heat treating Method and apparatus for heat treating

1991-11-29

1994-03-29

Yuen, Henry C.

Heating

Processes of heating or heater operation

Including preparing or arranging work for heating

432 6, 432 11, F23D 500

Patent

active

052979563

ABSTRACT:
A method and an apparatus for heat treating in a heat treating apparatus having a heating chamber to be introduced with predetermined gas, a heater disposed around the heating chamber, and jigs disposed in the heating chamber for supporting wafers of a plurality of substrates to be treated in parallel with each other, wherein in order to make the temperature distribution of the wafers of the substrates to be treated in the radial direction uniform in the heat treatment, the jigs are formed to determine the sizes and the shape thereof in predetermined ranges having a gradient according to the heat treating method having a predetermined shape determining procedure so that the jigs are formed in ring-shaped trays (i.e. support-ring) for holding at the peripheries the substrates to be treated and the thickness of the tray is constant or such that the outer peripheral side thereof is thicker than the inner peripheral side thereof.

REFERENCES:
patent: 4802842 (1989-02-01), Hirayama
patent: 4938691 (1990-07-01), Ohkase et al.
patent: 5131842 (1992-07-01), Miyazakai et al.

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