Method and apparatus for handling wafers

Details Method and apparatus for handling wafers Method and apparatus for handling wafers

1992-11-25

1995-12-26

Snow, Walter E.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324757, 414416, G01R 104

Patent

active

054791081

ABSTRACT:
A method and apparatus for handling wafers. A wafer pick moves along a horizontal x-axis to unload a wafer from a cassette and position the wafer over a chuck. The chuck moves upwardly along a z-axis perpendicular to the surface of the wafer and lifts the wafer off the pick. The pick retracts through a slot in the chuck and a test probe moves along the x-axis to position itself over the wafer and chuck with reference to a calculated wafer center. The chuck then moves upwardly to engage the surface of the wafer with the probe. Wafer characteristics are tested at several test points located on a circle on the surface of the wafer by repeatedly lowering the chuck, rotating the chuck by a small amount, and raising the chuck to engage the wafer with the probe. The probe is then positioned to test another circle of points.

REFERENCES:
patent: 4755747 (1988-07-01), Sato

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