Method and apparatus for handling semiconductor wafers

Details Method and apparatus for handling semiconductor wafers Method and apparatus for handling semiconductor wafers

1986-08-12

1988-06-21

Godici, Nicholas P.

Material or article handling

Vertically swinging load support

Grab

414763, 414786, B65G 4791

Patent

active

047521805

ABSTRACT:
A method and apparatus for handling semiconductor wafers comprises first and second tables having first and second elastic bases each of which has one surface on which a semiconductor wafer having a mirror surface is mounted with the mirror surface facing up and the other surface, and a plurality of through holes extending from one to the other surfaces thereof, a suction mechanism for reducing pressure in the through holes and chucking the semiconductor wafers to said bases and a projecting mechanism, provided to face the other surface of at least said second base, for urging the other surface to elastically deform said base corresponding thereto, thereby projecting a central portion of said base to project the mirror surface of the semiconductor wafer. The projecting mechanism includes projecting member having a conical end surface which is capable of being brought into contact with the other surface of the second elastic base.

REFERENCES:
patent: 3887783 (1975-06-01), Comette
patent: 3921885 (1975-11-01), Knox
patent: 4181249 (1980-01-01), Peterson et al.
patent: 4196837 (1980-04-01), Burkart
patent: 4226569 (1980-10-01), Gerard et al.
patent: 4409278 (1983-10-01), Jochym
patent: 4529353 (1985-07-01), Dean et al.
Yoshikawa, K., "Nikkei Electronics", Jan. 27, 1986, pp. 108-110.

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