Method and apparatus for handling semiconductor chips

Details Method and apparatus for handling semiconductor chips Method and apparatus for handling semiconductor chips

1999-04-05

2000-02-29

Foster, Jim

Package making

Methods

Filling preformed receptacle and closing

206460, 206723, 206725, B65D 8590, B65B 2500

Patent

active

060294272

ABSTRACT:
An apparatus and a method for receiving and transporting semiconductor chips. The chips are placed in pockets on a top surface of a first carrier. A similar carrier has an adhesive sheet placed on its top surface, and it is inverted and placed on the first carrier. A vacuum is pulled on orifices leading to the pockets. The vacuum pulls the flexible sheet into contact with the chips. The second carrier is then removed from the first carrier. Air pressure may be introduced to assist in the removal. A cover may be placed over the second carrier.

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patent: 5833073 (1998-11-01), Schatz et al.
patent: 5848702 (1998-12-01), Pakeriasamy

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