Method and apparatus for handling leaded and leadless surface mo

Metal working – Method of mechanical manufacture – Electrical device making

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Details

29740, 414225, H05K 334, B23P 1900

Patent

active

047699043

ABSTRACT:
The present invention involves a method and apparatus for sequencing leadless and leaded surface mountable components, feeding them directly from a sequencer to chip placement heads, and placing them at selected locations on a circuit board. The chip carriers of an endless chain conveyor carry each component of the sequence of components to a chip placement head. Direct supply from a sequencer having the chip carriers and a series of individual programmably controlled dispenser heads provides for quick and flexible variation of the input sequence without manual intervention. A plurality of the chip placement heads are mounted on a turret assembly to facilitate continuous unloading of the chip carriers and orienting, centering, and squaring of the components prior to placement on a circuit board.

REFERENCES:
patent: 4290732 (1982-09-01), Taki et al.
patent: 4372802 (1983-02-01), Harigane et al.
patent: 4437232 (1984-03-01), Araki et al.
patent: 4473247 (1984-09-01), Itemadani et al.
patent: 4529353 (1985-07-01), Dean et al.

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