Method and apparatus for handling element on an adhesive film

Details Method and apparatus for handling element on an adhesive film Method and apparatus for handling element on an adhesive film

1998-08-04

2000-09-26

Aftergut, Jeff H.

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

156584, 438464, H01L 21301, B32B 3118

Patent

active

061238007

ABSTRACT:
A system for handling semiconductor and electronic elements secured to an adhesive surface is provided. According to one aspect of the invention, a vacuum is applied through holes in a loading base. Under the influence of the vacuum, the adhesive film is pulled down toward the loading base and stretched around a pick rod so that the adhesive film is peeled away from the element. Thus, adhesive contact between the film and the element is reduced and a vacuum pick or collet is able to lift the element from the adhesive film with minimal force applied to the surface of the element.

REFERENCES:
patent: 4296542 (1981-10-01), Gotman
patent: 4472218 (1984-09-01), Avedissian et al.
patent: 4711014 (1987-12-01), Althouse
patent: 4778326 (1988-10-01), Althouse et al.
patent: 4859269 (1989-08-01), Nishiguchi
patent: 4921564 (1990-05-01), Moore
patent: 5589029 (1996-12-01), Matsui et al.

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