Method and apparatus for grinding magnetic member and method...

Abrading – Abrading process – Combined abrading

Reexamination Certificate

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C451S450000

Reexamination Certificate

active

07040969

ABSTRACT:
An apparatus for grinding a magnetic member comprises a cutting blade having a cutting edge including heat resistant resin and abrasive grain. A magnetic member including a rare-earth alloy is ground by the cutting blade while grinding fluid primarily made of water is supplied to a grinding region. A magnet separator having a surface magnetic flux density not smaller than 0.25 T magnetically separates sludge from used grinding fluid. Further, the grinding fluid is introduced into a tank, where the sludge contained in the grinding fluid is allowed to coagulate and sediment. The grinding fluid separated from the sludge is used in circulation. The same separation process can be used for separation of sludge containing a rare-earth alloy from waste fluid.

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Notice of Rejection to the corresponding Taiwanese Patent Application No. 89111394 (and translation thereof).
*Note: U.S. Patent No. 5,938,935 corresponds to Taiwanese Patent No. 333472)*.
Notification of Reason(s) for Refusal to the corresponding Japanese Patent Application No. 2000-181988 (and translation thereof (2 pages)) dated Aug. 20, 2002.
Decision of Refusal to corresponding Japanese Patent Application No. 2000-181988 (and translation thereof (2 pages)).
Publication for the corresponding Philippine Patent Application No. 1-2000-01515; IPO Gazette vol. V No. 9 released on Dec. 10, 2002.
Decision of Refusal to corresponding Japanese Patent Application No. 2000-181988 (and translation thereof (2 pages)).
Publication for the corresponding Philippine Patent Application No. 1-2000-01515; IPO Gazette vol. V No. 9 released on Dec. 10, 2002.
Decision of Refusal to corresponding Japanese Patent Application No. 2000-181988 (and translation thereof (2 pages)).
Publication for the corresponding Philippine Patent Application No. 1-2000-01515; IPO Gazette vol. V No. 9 released on Dec. 10, 2002.
Notification of Reason(s) for Refusal to the corresponding Japanese Patent Application No. 2000-181988 (and translation thereof (2 pages)) dated Aug. 20, 2002.

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