Method and apparatus for generating an OPC segmentation...

Data processing: structural design – modeling – simulation – and em – Simulating electronic device or electrical system – Circuit simulation

Reexamination Certificate

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C716S030000, C716S030000

Reexamination Certificate

active

07451068

ABSTRACT:
One embodiment of the invention provides a system that dissects edges of a layout of an integrated circuit to produce a segmentation of the layout for a subsequent optical proximity correction (OPC) operation. In order to perform the dissection, the system first performs a model-based simulation on the layout to generate intensity gradients along edges of features in the layout. Next, the system generates a segmentation for edges in the layout based upon the intensity gradients. This segmentation is used during a subsequent optical proximity correction (OPC) process to generate corrections for the layout so that the layout prints more accurately on a semiconductor chip.

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Melvin III et al. (Model-based methodology for reducing OPC output pattern complexity, SPIE 2003).
Fanget et al. (Adjustment of Optical Proximity Correction (OPC) Software for Mask Process Correction (MPC), Oct. 2001).
Publication entitled “A Model-Based Methodology for Reducing OPC Output Pattern Complexity”, by Lawrence S. Melvin III, Proceedings of SPIE, vol. 5256, 23rdAnnual BACUS Symposium on Photomask Technology, XP-002367949, pp. 238-245.
Publication entitled “OPC Strategies to Minimize Mask Cost and Writing Time”, by Michael L. Rieger, Proceedings of SPIE, vol. 4562, 21 st Annual BACUS Symposium on Photomask Technology, XP-002367949, pp. 154-160.
Internet Article entitled “Proteus, Progen, Prospector Full-Chip Optical Proximity Correction”, Apr. 14, 2003, XP002367951,URL: http://web.archive.org/web/20030414050107/www.synopsys.com/products/avmrg/pdfs/proteus—ds.pdf.

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