Method and apparatus for fully aligned flip-chip assembly...

Details Method and apparatus for fully aligned flip-chip assembly... Method and apparatus for fully aligned flip-chip assembly...

2005-01-11

2005-01-11

Zarneke, David A. (Department: 2829)

Data processing: generic control systems or specific application

Specific application, apparatus or process

Product assembly or manufacturing

C438S015000

Reexamination Certificate

active

06842662

ABSTRACT:
A method and an apparatus for preventing misalignment of semiconductor packaging assembly materials. In particular, a method of fabricating a fully aligned flip-chip assembly having a variable pitch packaging substrate, involves: providing a set of input data; calculating a set of intermediate data using the input data set; calculating a set of final substrate pad coordinates using the intermediate data set, thereby providing a set of output data; providing a packaging substrate having a plurality of substrate pads thereon formed according to the output data set to compensate for any inchoate thermogeometric hysteresis arising from any mismatched coefficients of thermal expansion, and thereby fabricating the flip-chip assembly having a variable pitch packaging substrate, and an assembly thereby fabricated which is more robust to any temperature-induced stress.

REFERENCES:
patent: 6555401 (2003-04-01), Koduri

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